XZZ GL-01 GL-02 Heat Resistant Glass Fixture Phone PCB IC Clamp Glue Adhesive Beeping function

Beeping function

Temperature measurement accuracy: ±5℃ or ±5%

9x HIC(HIC1-9)

IR-Remote x1(not included the battery)

ATTEN WX-2008D BGA soldering rework station hot air gun

XZZ GL-01 GL-02 Heat Resistant Glass Fixture Phone PCB IC Clamp Glue Adhesive Beeping functionXZZ GL 01 360 Rotating Circular Glass Clamp and XZZ GL 02 Square High Temperature Resistant Glass Fixture for Mobile Phone Motherboards CPU Chips Soldering Repair. Equipped with V shaped bevel and two way screw adjustment, it can firmly clamp the mobile phone motherboard, CPU, and chips, which is very suitable for removing glue, cleaning and soldering to repair mobile phone chips, CPU and other IC components to prevent damage. Option: 1. XZZ GL 01