MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items 5 Convex Cross/Phillips 1

5 Convex Cross/Phillips 1

"Multiple" port charging

can be connected to mobile phone and computer

Option 3: For iPhone X-11 pro max Pre-Heating groove

ultra-precision cutting

MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items 5 Convex Cross/Phillips 1MECHANIC Heat Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one click heating, adjustable from 160C to 250C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal. Features: 1. Employs a professional temperature control curve algorithm with a built in factory calibrated