MIJING TC-10 Ceramic Knife Suit Carving Blade IC Glue Removal Option:MIJING TC-10 The upper layer and lower

The upper layer and lower layer of iPhone 13 series logic board is weld together

Image parameters: adjustable sharpness

films up to 16 inches can be cut and adapted to various electronic devices

AC: 50 / 60Hz

90W Quick 203H digital display soldering station for Phone repair

MIJING TC-10 Ceramic Knife Suit Carving Blade IC Glue Removal Option:MIJING TC-10 The upper layer and lowerMIJING TC 10 Ceramic Knife Suit 3 in 1 knife handle with blade for mobile phone nand chip IC glue removal. ceramic blade carving knife non slip knife suitable for mobile phone laptop PCB repair and motherboard dot matrix camera disassembly and repair. Features: 1. Thin blade, high temperature resistance, can withstand up to 1000 degrees, compatible with black glue removal and high temperature cutting. 2. Remove IC and pad black glue, pry open CPU IC