SKU: 80976607987
Ships within 48 hours · Estimated delivery Aug 24 - Aug 29
High-Low Temperature
5 or higher
Ringtone Amplifier IC If damaged
Simply unpack this soldering iron and connect it to a mains socket
Visual calibration of battery settings
MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZW25 0.76mm High-Low TemperatureMECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools MECHANIC solder ball 25000PCS Bottle Notice: XZ25 is Lead solder ball, XZW25 is Lead free Solder ball. The BGA solder ball has the following characteristics: Meet EU ROHS and REACH standards. With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. Purity and sphericity are very high,
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US$ 54.95
US$ 48.00
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US$ 70.00
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