Blueprint studio · Spec sheets · Amber callouts · Free shipping over $75
Sheet A · Product board
Unit price
USD16.59
USD64.59

Pay in 4 interest-free payments of $4.15 Learn more

Field rating
4.1

Verified studio score · Spec revision current

Fit · Size

RL-044 BGA Stencil For iPhone Huawei Samsung Xiaomi Android CPU Back Glass Replacement YIHUA 862D+ BGA 2 in

SKU: 86107923857

Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 31 - Sep 5

Description

YIHUA 862D+ BGA 2 in 1 Rework Station Tool / Cell Phone Desoldering Station

iPhone 11/1 Pro/11 Pro Max

separate LCD screen: 11-inch design (249*157mm)

1x Repair Tools Set

6 inch) 20-245X (21 inch) Max 1000X

RL-044 BGA Stencil For iPhone Huawei Samsung Xiaomi Android CPU Back Glass Replacement YIHUA 862D+ BGA 2 inRELIFE RL 044 Precision BGA Reballing Stencil CPU Chip Integrated Steel Mesh For iPhone 6 15 Pro Max, Huawei, Samsung Xiaomi and Android CPU series (SMC Qualcomm Snapdragon series, MTC Dimensity series, HIC hisilicon Kirin series, EMMC BGA series, ACU Android series). RELIFE RL 044 Integrated Tin Planting Steel Stencil For iPhone Huawei Samsung Xiaomi Android CPU RAM Power IC Chip Soldering Reballing Repair. Option: 1. RELIFE RL 044 iPhone series BGA

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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