LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope Multiple combination modules

Multiple combination modules

OCA Lamination And Screen Alignment 2 In 1 Mold for iPhone X/XS

Color: Grey + Blue

the lead-free soldering iron tip has fast heat conduction

Extremely low noise and space saving design

LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope Multiple combination modulesLuowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate for mobile phone PCB board layering laminating chip glue removal, etc. Luowei HS3 99W constant temperature control preheating platform 65mm*100mm heating size suitable for various mobile phone motherboards tinning, degumming, and laminating, etc. Features: 1. Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient