SKU: 13977413063
Ships within 48 hours · Estimated delivery Sep 5 - Sep 10
Technical Specifications:
Flexural modulus (MPa): 1826 (ZX)
Ergonomic design: Comfortable grip for better control and less strain during prolonged use
Improved image accuracy
An emphasis on exquisite details and innovative design ensures that your parts achieve an impressive level of quality
bambu lab enclosure plastic bottom ring h2 series Bambu Lab - H2D Laser Full Combo - 10W - Reservedele Technical Specifications:Bambu Lab Enclosure Plastic Bottom Ring H2 Series Bambu Lab Enclosure Plastic Bottom Ring til H2 Series er den originale bundramme i plast, som giver strukturel stabilitet til printerens kabinet og fungerer som monteringsbase for printerens fdder. Denne komponent er en central del af printerens konstruktion og sikrer korrekt opbygning, stabil placering og vibrationsdmpning. Bundringen understtter printerens samlede struktur og bidrager til at reducere
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